Smt Red Glue Adhesive

The red glue process was developed because there were still many electronic components that could not be transferred from the original plug-in (DIP) package to the surface mount (SMD) package immediately. Imagine a circuit board has half DIP parts and the other half is SMD parts. How do you place these parts so that they can all be automatically soldered to the board? The general practice is to design all DIP and SMD parts on the same side of the PCB board. SMD parts are printed with solder paste and soldered in the reflow furnace, while the remaining DIP parts are exposed on the other side of the circuit board because all solder feet are exposed., So you can use the wave soldering furnace process to solder all the DIP solder feet at one time.