Thermally Annealed Pyrolytic Graphite Heat Spreader

TC1050 heat spreader consists of a TPG* core encapsulated within a structural shell. The TPG provides a highly conductive path while the encapsulation material provides the structure (strength, stiffness, and coefficient of thermal expansion). Common Encapsulation Materials include: Aluminum (TC1050.AL) Copper (TC1050.CU) Other available encapsulations and systems include Kovar, WCu, MoCu, AlSiC, stainless steel, Ni, carbon fiber, etc. Key Features Thermal conductivity 5x of aluminum and 3x of copper Low thermal interface resistance Lighter than aluminum Adjustable coefficient of thermal expansion Wide operating temperature range Mechanical load bearing Hermeticity higher than 10-8 atm.cc/s Vibration and shock resistance Machinable Platable Size up to 4 ft2 (0.37 m2) Potential Applications Heat spreader in electronic packaging Thermal cores for PWB's Finned heat sinks Avionic thermal cores Satellite traveling wave tube (TWT) mounts Electronic chassis Cold plates in radar systemsMarkets Served Delhi, Mumbai, Kolkata, Chennai, Bangalore, Pune , Ahmedabad, Vadodra,Surat, Vapi, Aurangabad, Kohlapur, Raigad, Raipur, Lucknow, Jaipur, Udaipur, Trivandrum, Coimbatore, Bhopal, Gurgaon, Raipur, Manesar, Bhubaneshwar, Jamshedpur, Hyderabad, Vizag, Vijayawada, Goa, Hosur, Nagpur, Rajkot, Kanpur, India