FCCL Polyimide Flexible Copper Clad Laminate

The FCCL is base materials of Flexible Printed Circuit Board (FPC). In addition to the advantages of thinness, lightness, and flexibility, FCCL using polyimide film as a insulation and high temperature reisitant layer,also has excellent electrical properties, thermal properties, and heat resistance. Its lower dielectric constant (Dk) allows fast transmission of electrical signals. It has good thermal properties that make the components easy to cool down. And a higher glass transition temperature (Tg) allows the assembly to operate well at higher temperatures. Since most of FCCL's products are supplied to users in a continuous roll form, the use of FCCL to produce printed circuit boards facilitates automated continuous production of FPCs and continuous surface mounting of components on FPCs. Soft copper foil substrates (FCCL) are divided into two categories: traditional three-layer soft board substrate (3L FCCL) and new non-adhesive two-layer soft board substrate (2L FCCL). It is composed of a flexible insulating base film and a metal foil. The flexible copper clad laminate made of three different materials of copper foil, film and adhesive is called a three-layer flexible copper clad laminate (referred to as "3L-FCCL" for short). ). The adhesive-free flexible copper clad laminate is called a two-layer flexible copper clad laminate ("2L-FCCL" for short). Since the two types of flexible copper foil substrates are manufactured in different ways, the material properties of the two types of substrates are also different. About application, two types of FCCL application products are different, 3L-FCCL is applied to large-scale soft board products, and 2L FCCL is applied to higher-order soft board manufacturing, such as soft and rigid boards, COF and so on.