Ceramic/Alumina drilling cutting scribing machine

We, Kriti Laser, are offering advanced Ceramic / Alumina Drilling, Cutting & Scribing Machine, specially designed for high-precision processing of hard and brittle materials. This machine uses laser technology to deliver clean cuts, accurate drilling, and fine scribing without causing cracks or damage to the material. It is ideal for industries requiring micro-level accuracy and smooth finishing, especially in ceramic and alumina components. Key Features: High precision drilling, cutting, and scribing Non-contact laser process (no tool wear) Minimal heat-affected zone Smooth edges with burr-free finishing High-speed and stable performance User-friendly control system Applications: Alumina ceramic substrate processing Electronic components and circuit boards Semiconductor industry Precision engineering parts Micro-hole drilling and fine pattern scribing Materials Supported: Alumina (Al₂O₃) Ceramic substrates Glass and brittle materials Thin metal-coated ceramics Technical Specifications (Typical): Laser Type: UV / Fiber / CO₂ (as per requirement) Power Range: Customizable Working Area: As per application Cooling System: Air / Water Cooling Accuracy: High precision (micron-level) Why Choose Kriti Laser? Advanced laser technology solutions Customized machine design as per need Reliable performance and durability Competitive pricing Strong after-sales service support