Thermally Conductive Silicone Pad

3M™ Thermally Conductive Silicone Interface Pad 5514 Size :-250mmx20M Features :- Good thermal conductivity (1.6 W/m-K) Hardness : Shore 00 = 58 Good dielectric properties UL 94 V-0 High temperature resistance Good converting for complicated shape Good flexibility with over bending Thin thickness, 0.2 mm 0.25 mm Roll is available Heat transfer between PCB and heat sink Integrated chip (IC) packaging heat conduction Chip on film (COF) heat dissipation Gap filling in electronic devices Decrease of compression stress to electronic parts by thermal pad softness Additional Information: Production Capacity: 1000