Alpha Cookson Lead Free Solder Paste

Alph Cookson Lead Free Solder PastePRODUCT INFORMATION Alloys: SAC305 (96.5%Sn/3.0%Ag/0.5%Cu) SAC405 (95.5%Sn/4.0%Ag/0.5%Cu) SACX® Plus™ 0307 (99%Sn/0.3%Ag/0.7%Cu) SACX® Plus™ 0807 (98.5%Sn/0.8%Ag/0.7%Cu) Innolot (90.95%Sn/3.8%Ag/0.7%Cu/1.4%Sb/0.15%Ni/3%Bi) For other alloys, please contact your local Cookson Electronics Sales Office. Powder Size: Type 3 (25 - 45μm per IPC J-STD-005) Type 4 (20 - 38μm per IPC J-STD-005) Type 5 (15 - 25μm per IPC J-STD-005) Residues: Approximately 5% by (w/w) Packaging Sizes: 500 gram jars, 6” & 12” cartridges, DEK ProFlow® cassettes, and 10cc and 30cc dispense syringes Flux Gel: OM-340 Flux Gel is available in 10cc and 30cc syringes for rework applications. Lead Free: Complies with RoHS Directive 2002/95/EC. Additional Information: Item Code: CVP390Production Capacity: 1000 kgDelivery Time: 2 to 3 day'sPackaging Details: 10 kg in one box